Express Newsletter: package re- prebake (Page 1 of 57)

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Defect Free QFN Assembly

Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder

Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is To Deliver Optimum Balance between Landed Cost and Time to Market

Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is To Deliver Optimum Balance between Landed Cost and Time to Market Online Version SMTnet Express, October 13, 2016, Subscribers: 26,523, Companies: 14

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