BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
Nanofluids, Nanogels and Nanopastes for Electronic Packaging Reminder: There will not be a SMTnet Newsletter next week. Nanofluids, Nanogels and Nanopastes for Electronic Packaging This paper discusses polymer based nanogels, nanofluids
XTECH Auctions announces ETN Auction ☀ October 17–21, 2021 SMTnet Express, October 14, 2021, Subscribers: 26,613, Companies: 11,452, Users: 26,884 A Novel Authentication Methodology to Detect Counterfeit PCB Using PCB Trace
Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general
Voiding Control for QFN Assembly Voiding Control for QFN Assembly Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size
Implementation challenges for PCB tracking using RFID Implementation challenges for PCB tracking using RFID Radio frequency identification (RFID) ICs are a popular alternative to barcodes for PCB tracking applications. This article outlines some
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