994 packaged pcb shelf life results

BGA Package Component Reliability After Long-Term Storage

BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension

SMT Express, Volume 4, Issue No. 2 - from SMTnet.com

SMTnet Express - March 3, 2022

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

3D IC Development Needs Innovative Socket Solution

Nanofluids, Nanogels and Nanopastes for Electronic Packaging

Nanofluids, Nanogels and Nanopastes for Electronic Packaging Reminder: There will not be a SMTnet Newsletter next week. Nanofluids, Nanogels and Nanopastes for Electronic Packaging This paper discusses polymer based nanogels, nanofluids

XTECH Auctions announces ETN Auction ☀ October 17–21 - 2021 SMTnet Express, October 14

XTECH Auctions announces ETN Auction ☀ October 17–21, 2021 SMTnet Express, October 14, 2021, Subscribers: 26,613, Companies: 11,452, Users: 26,884 A Novel Authentication Methodology to Detect Counterfeit PCB Using PCB Trace

Strength of Lead-free BGA Spheres in High Speed Loading

Strength of Lead-free BGA Spheres in High Speed Loading Strength of Lead-free BGA Spheres in High Speed Loading Concern about the failure of lead-free BGA packages when portable devices such as cell phones are accidentally dropped and a general

Voiding Control for QFN Assembly

Voiding Control for QFN Assembly Voiding Control for QFN Assembly Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size

Implementation challenges for PCB tracking using RFID

Implementation challenges for PCB tracking using RFID Implementation challenges for PCB tracking using RFID Radio frequency identification (RFID) ICs are a popular alternative to barcodes for PCB tracking applications. This article outlines some