Power Supply Control from PCB to Chip Core Power Supply Control from PCB to Chip Core As silicon technology advances to enable higher density ASICs, the core logic voltage decreases. The lower voltage, in combination with higher current
Organic Flip Chip Packages for Use in Military and Aerospace Applications Featured Article Organic Flip Chip Packages for Use in Military and Aerospace Applications Endicott Interconnect Technologies David Alcoe, Kim Blackwell and Irving Memis
to package these devices in the flip-chip BGA form factor (
Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale
Technical Considerations For Controlling ESD In Electronics Manufacturing Technical Considerations For Controlling ESD In Electronics Manufacturing As device geometries get smaller and processing speeds grow faster, their ESD sensitivity
Lead-Free Rework Process For Chip Scale Packages News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Lead-Free Rework Process For Chip Scale Packages Universal Instruments
Air Flow Measurement in Electronic Systems Air Flow Measurement in Electronic Systems Electronic circuit boards create some of the most complex and highly three dimensional fluid flows in both air and liquid. The combination of open channel
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