Organic Flip Chip Packages for Use in Military and Aerospace Applications Featured Article Organic Flip Chip Packages for Use in Military and Aerospace Applications Endicott Interconnect Technologies David Alcoe, Kim Blackwell and Irving Memis
BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension
packaging industry. In those early days, componen