The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN
Voiding Control for QFN Assembly Voiding Control for QFN Assembly Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size
SMTnet Express, October 29, 2015, Subscribers: 23,683, Members: Companies: 14,724, Users: 39,236 Novel Approaches for Minimizing Pad Cratering Chen Xu, Yunhu Lin; Alcatel-Lucent, Yuan Zeng, Pericles A. Kondos; Unovis-Solutions.; Alcatel
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Return to Previous Page PRINTED CIRCUIT BOARD FABRICATION BASICS AN OUTLINE Earl Moon Proof Of Design (POD) PURPOSE AND SCOPE
winsouce.jpg)
