Express Newsletter: pad design (Page 16 of 109)

HASL - WHAT A HASSLE, or HASL'd AGAIN.

HASL - WHAT A HASSLE, or HASL'd AGAIN. If you don't see the images, please visit online version at #Application.SmtNet.baseURL#/express/ Featured Article HASL - WHAT A HASSLE, or HASL'd AGAIN. Proof Of Design MoonMan This article updates

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint


pad design searches for Companies, Equipment, Machines, Suppliers & Information

2024 Eptac IPC Certification Training Schedule

High Resolution Fast Speed Industrial Cameras.
One stop service for all SMT and PCB needs

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Voidless Reflow Soldering

High Throughput Reflow Oven
Void Free Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications


"回流焊炉"