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SMT Express, Volume 3, Issue No. 1 - from SMTnet.com

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array SMTnet Express June 22, 2012, Subscribers: 25283, Members: Companies: 8903, Users: 33267

SMTnet Express March 21 - 2013, Subscribers: 26266

SMT Express, Issue No. 3 - from SMTnet.com

for missing balls (BGA's - figure 23), or bent or missing l

Void Detection in Large Solder Joints of Integrated Power Electronics

SMTnet Express - July 24, 2014

SMTnet Express - February 12, 2015

SMTnet Express, February 12, 2015, Subscribers: 22,336, Members: Companies: 14,215, Users: 37,692 Evaluating the Mechanical Reliability of Ball Grid Array (BGA) Flexible Surface-Mount Electronics Packaging under Isothermal Ageing Sabuj Mallik

SMTnet Express - January 21, 2016

SMTnet Express - September 7, 2017

SMTnet Express, September 7, 2017, Subscribers: 30,782, Members: Companies: 10,712, Users: 23,761 Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift Young K. Song and Vanja Bukva; Teledyne DALSA As a surface finish for PCBs

SMT Express, Volume 3, Issue No. 9 - from SMTnet.com