85 panned results

PCB Dynamic Coplanarity At Elevated Temperatures

PCB Dynamic Coplanarity At Elevated Temperatures PCB Dynamic Coplanarity At Elevated Temperatures iNEMI's SMTAI 2011 presentation by: John Davignon, Ken Chiavone, Jiahui Pan, James Henzi, David Mendez, Ron Kulterman; Intel Corporation

A Unified CAD-PLM Architecture for Improving Electronics Design Productivity through Automation, Collaboration, and Cloud Computing

Wafer-Level Packaged MEMS Switch With TSV

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

SMTnet Express August 29 - 2013, Subscribers: 26233

SMTnet Express August 29, 2013, Subscribers: 26233, Members: Companies: 13474, Users: 35110 Effect of Gold Content on the Microstructural Evolution of SAC305 Solder Joints Under Isothermal Aging by Mike Powers, Jianbiao Pan, Julie Silk, Patrick

SMTnet Express - January 28, 2015

SMTnet Express - December 7, 2016

SMTnet Express - December 15, 2016

SMTnet Express - December 29, 2016

SMTnet Express - January 12, 2017