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SMTnet Express January 24 - 2013, Subscribers: 26136

SMTnet Express January 24, 2013, Subscribers: 26136, Members: Companies: 9096, Users: 34208 An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications

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, and Mechanical Characteristics Sn—based lead—free

Prototyping Your New Electronic Product Idea

Selective Solder Paste Deposition Reliability Test Results

Comparing techniques for temperature-dependent warpage measurement

Testing Digital Designs - The Boundary-scan Balance

Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures

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be an optimal alloying addition in lead-free SAC (

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