738 part to pad led results

SMTnet Express - October 30, 2014

DOE for Process Validation Involving Numerous Assembly Materials and Test Methods

SMTnet Express - April 28, 2022

SMTnet Express - December 4, 2014

Production Line Dynamics: What Count Is What Actually Comes Out Of Your Line

Lead-Free BGA Rework-Transition

Laser Solder Reflow: A Process Solution, Part I

Laser Solder Reflow: A Process Solution, Part I News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Laser Solder Reflow: A Process Solution, Part I EFD, Inc Credit

BGA Package Component Reliability After Long-Term Storage

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

Reworking QFN's Newly Developed Cost Effective Approach

smeared solder paste pattern. A typical pad size for