Manufacturing Substrates with Embedded Passives Manufacturing Substrates with Embedded Passives Passives account for a very large part of today's electronic assemblies. This is particularly true for digital products such as cellular phones
Increasing system integration and component densiti
Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure Embedded passives
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