SMTnet Express, March 23, 2017, Subscribers: 30,333, Companies: 15,177, Users: 42,115 Water Soluble Solder Paste, Wet Behind the Ears or Wave of the Future Tony Lentz; FCT ASSEMBLY, INC. Water soluble lead-free solder paste is widely used in today
Reworking QFN's Newly Developed Cost Effective Approach Reworking QFN's Newly Developed Cost Effective Approach As with any rework process, the pasting of the component is a sequential process. Each step is designed to minimize the risk of a
The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards Universal Instruments Credit/Source: Jay B. Hinerman, K. Srihari, Ph
Sustaining a Robust Fine Feature Printing Process Sustaining a Robust Fine Feature Printing Process With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology
