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Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need
SMTnet Express, May 12, 2016, Subscribers: 24,536, Companies: 14,773, Users: 40,243 Influence of Plating Quality on Reliability of Microvias Yan Ning, Michael H. Azarian, Michael Pecht; CALCE Center for Advanced Life Cycle Engineering Advances
SMTnet Express, June 15, 2017, Subscribers: 30,470, Companies: 10,610, Users: 23,373 Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT) Flex International
SMTnet Express, June 13, 2024, Subscribers: 25,650, Companies: 12,175, Users: 29,054 █ Electronics Manufacturing Technical Articles Influence of Plating Quality on Reliability of Microvias Advances in miniaturized electronic devices
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