696 pdt and machine results

Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study

Lead-Free BGA Rework-Transition

The Pin-in-Paste (or AART) Process for Odd Form and Through Hole Printed Circuit Boards

Prototyping Your New Electronic Product Idea

Selective Solder Paste Deposition Reliability Test Results

Reduced Oxide Soldering Activation (ROSA)

Two-Photon Polymerization: A New Approach to Micromachining

SMT Express, Volume 4, Issue No. 5 - from SMTnet.com

the defect rate of the measured machine. For exampl

SMT Express, Volume 5, Issue No. 3 - from SMTnet.com

SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 1             Page 3 >> Knowing the capability coefficients, it is possible to estimate the defect rate of the measured machine. For example, Cpk = 1

SMT Express, Volume 4, Issue No. 5 - from SMTnet.com

SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Machine Capability Measurement on SMT Equipment by Romain Schmitt, Jean Marie Guillet - Solectron