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High Reliability Test Products

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints.

SMTnet Express - December 16, 2021

Achieving SMT Compatible Flip Chip Assembly With No-Flow Fluxing Underfills

SMTnet Express - November 3, 2016

Implementing Lead Free Soldering European Consortium Research

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

Lead-Free Wave Soldering

SMT Express

SMT Express, Volume VI, Issue No. 2 - from SMTnet.com

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