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Implementation challenges for PCB tracking using RFID

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards

SMTnet Express - March 06, 2014

SMTnet Express - February 9, 2017

SMTnet Express, February 9, 2017, Subscribers: 30,132, Companies: 15,113, Users: 41,841 Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue? Eric Bastow; Indium Corporation The SMT assembly world

A Review of Test Methods and Classifications for Halogen-Free Soldering Materials

HALT Testing of Backward Soldered BGAs on a Military Product

Defect Free QFN Assembly

Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder

SMTnet Express - December 10, 2015

SMTnet Express - July 28, 2016