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169 pitch mismatch results

Express Newsletter: pitch mismatch (Page 12 of 17)

SMT Express, Volume 3, Issue No. 10 - from SMTnet.com

Bohai Electronics Week 2006

Assembly And Reliability Issues Associated With Leadless Chip Scale Packages

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

Electronic Manufacturing Service Provider

Lead-Free Rework Process For Chip Scale Packages

Troubleshooting Shop Floor Rework Difficulties

Fragility of Pb-free Solder Joints

Selective Solder Paste Deposition Reliability Test Results

Implementing Lead Free Soldering – European Consortium Research

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