81 preform 0402 results

Head-in-Pillow BGA Defects

Conductive Adhesives: The Way Forward

Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

SMT Express, Volume 2, Issue No. 4 - from SMTnet.com

SMTnet Express - April 15, 2021

SMT Express, Volume 3, Issue No. 8 - from SMTnet.com

SMT Express, Volume 2, Issue No. 5 - from SMTnet.com

IPC Printed Circuits Expo APEX

SMTnet Express - May 21, 2015

SMTnet Express, May 21, 2015, Subscribers: 22,770, Members: Companies: 14,358, Users: 38,224 Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting Brent Fischthal, Michael Cieslinski; Panasonic Factory Solutions Company

Stencil Design using Regression