292 purity nitrogen copper results

SMT Express, Volume 3, Issue No. 4 - from SMTnet.com

Pad Cratering - The Invisible Threat to the Electronics Industry

SMTnet Express March 28 - 2013, Subscribers: 26288

SMTnet Express March 28, 2013, Subscribers: 26288, Members: Companies: 13327, Users: 34493 A Designed Experiment for the Influence of Copper Foils on Impedance, DC Line Resistance and Insertion Loss by: Alexander Ippich; Multek For the last couple

Ground Pours - To Pour Or Not To Pour?

Ground Pours - To Pour Or Not To Pour? Ground Pours - To Pour Or Not To Pour? Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias

SMTnet Express April 25 - 2013, Subscribers: 26322

SMTnet Express April 25, 2013, Subscribers: 26322, Members: Companies: 13358, Users: 34615 Determination of Copper Foil Surface Roughness from Micro-section Photographs by: Scott Hinaga, Soumya De, Aleksandr Y. Gafarov, Marina Y. Koledintseva

Connector Models - Are They Any Good?

circuit board (PCB) materials (copper finish, dielectric

SMTnet Express February 28 - 2013, Subscribers: 26214

SMTnet Express March 21 - 2013, Subscribers: 26266

SMTnet Express August 8 - 2013, Subscribers: 26202

SMTnet Express September 19 - 2013, Subscribers: 26298