SMTnet Express March 28, 2013, Subscribers: 26288, Members: Companies: 13327, Users: 34493 A Designed Experiment for the Influence of Copper Foils on Impedance, DC Line Resistance and Insertion Loss by: Alexander Ippich; Multek For the last couple
Ground Pours - To Pour Or Not To Pour? Ground Pours - To Pour Or Not To Pour? Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias
SMTnet Express April 25, 2013, Subscribers: 26322, Members: Companies: 13358, Users: 34615 Determination of Copper Foil Surface Roughness from Micro-section Photographs by: Scott Hinaga, Soumya De, Aleksandr Y. Gafarov, Marina Y. Koledintseva
circuit board (PCB) materials (copper finish, dielectric
.gif)
