111 qfn bridging results

Defect Free QFN Assembly

Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder

Mass Analysis Of The Components Separated From Printed Circuit Boards.

Implementing Lead Free Soldering – European Consortium Research

A High Performance and Cost Effective Molded Array Package Substrate

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology

Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors

Solder Paste Inspection Technologies: 2D-3D Correlation

Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish

The Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish SMTnet Express October 19, 2012, Subscribers: 25598, Members: Companies: 9011, Users: 33828 The Morphology Evolution and Voiding of Solder Joints on QFN