958 qfn reflow second side results

Power Supply Control from PCB to Chip Core

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com

Developments in Fine Line Resist Stripping

Criminal Prosecution - Who can be held liable for the sale of counterfeit parts?

The Reliability Challenges of QFN Packaging

The Reliability Challenges of QFN Packaging The Reliability Challenges of QFN Packaging The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages

Defect Free QFN Assembly

Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components With PCB complexity and density increasing and also

A High Performance and Cost Effective Molded Array Package Substrate

Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is To Deliver Optimum Balance between Landed Cost and Time to Market

SMT Express, Volume 2, Issue No. 8 - from SMTnet.com