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The Reliability Challenges of QFN Packaging

The Reliability Challenges of QFN Packaging The Reliability Challenges of QFN Packaging The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages

What is really inside your AOI?

What is really inside your AOI? What is really inside your AOI? by: Jean-Marc Peallat, Russ Warncke, Russell Claybrook, Marc Brun; Vi TECHNOLOGY Installed for the first time 20 years ago, Automated Optical Inspection (AOI) more recently has become

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