463 quad flat no-leads thermal results

SMTnet Express - June 11, 2015

SMTnet Express - May 24, 2018

SMTnet Express - October 3, 2018

SMTnet Express - July 23, 2015

SMTnet Express - July 22, 2015

Voiding Control for QFN Assembly

Voiding Control for QFN Assembly Voiding Control for QFN Assembly Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size

Influence of Nanoparticles, Low Melting Point (LMP) Fillers, and Conducting Polymers on Electrical, Mechanical, and Reliability Performance of Micro-Filled Conducting Adhesives for Z-Axis Interconnections.

SMTnet Express - October 3, 2019

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com

The Reliability Challenges of QFN Packaging

The Reliability Challenges of QFN Packaging The Reliability Challenges of QFN Packaging The quad flat pack no lead or quad flat non-leaded (QFN) is one of the fastest growing package types in the electronics industry today. While the advantages