652 ray p. prasad results

The Call for Halogen-Free Electronic Assemblies

Thermal Residue Fingerprinting: A Revolutionary Approach to Develop a Selective Cleaning Solution

Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure

Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure Resin Coated Copper Capacitive (RC3) Nanocomposites for System in a Package (SiP): Development of 3-8-3 structure Embedded passives

The Environmental Cost of Green

The Environmental Cost of Green

Building Differentiated Products Through Shorter, More Predictable Design Cycles

markets and prospects with less available budget for p

Building Differentiated Products Through Shorter, More Predictable Design Cycles

markets and prospects with less available budget for p

Screening for Counterfeit Electronic Components

Aiming for High First-pass Yields in a Lead-free Environment

Imbedded Component/Die Technology (IC/DT®)