Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures More and more chip packages need
RF Packaging Advancements RF Packaging Advancements EMPF / ACI Credit/Source: Fred Verdi The vast majority (99%) of the electronics market in North America is composed of products produced for commercial applications. The 1% share
A Review of Test Methods and Classifications for Halogen-Free Soldering Materials A Review of Test Methods and Classifications for Halogen-Free Soldering Materials Over the last few years, there has been an increase in the evaluation and use
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