Optimizing Flip Chip Substrate Layout for Assembly Optimizing Flip Chip Substrate Layout for Assembly High-density flip chip applications are commonly limited by the available substrate technologies. Accordingly, considerable design efforts
of assembling miniature components, such as micro BGA,
of assembling miniature components, such as micro BGA,
01005 production goes industry wide 01005 production goes industry wide The introduction of the 01005 chip components in 2004 was a challenge to the whole electronics equipment assembly industry. The components miniature size made them difficult
Solder Materials Science Gets Small as Miniaturization Challenges Old Rules Solder Materials Science Gets Small as Miniaturization Challenges Old Rules Though designing much smaller packages presents its own unique set of hurdles (a topic