260 rounded or square pads results

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) COMPARE PART SQUARENESS TO BOARD'S SILK-SCREEN OR TRACES A part

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

Using Hansen Space to Optimize Solvent Based Cleaning Processes for Manufacturing Electronic Assemblies

SMT Express, Volume 3, Issue No. 6 - from SMTnet.com

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission SMTnet Express January 3, 2013, Subscribers: 26072, Members: Companies: 9076, Users: 34113 Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

SMT Express, Issue No. 4 - from SMTnet.com

A High Performance and Cost Effective Molded Array Package Substrate

Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components

Novel Transmission Line for 40 GHz PCB Applications