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SMTnet Express, February 16, 2017, Subscribers: 30,171, Companies: 15,128, Users: 41,915 Component Level Reliability For High Temperature Power Computing With SAC305 And Alternative High Reliability Solders Thomas Sanders, Sivasubramanian
International Sn3.0Ag0.5Cu (SAC305) is the most popula
be an optimal alloying addition in lead-free SAC (
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Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Manufacturability & Reliability Challenges with Leadless Near Chip Scale (LNCSP) Packages in Pb-Free Processes Leadless, near chip scale
