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SMT Express
Troubleshooting Shop Floor Rework Difficulties
Lean, Mean Dual-Lane Machines
Process Development And Characterization Of The Stencil Printing Process For Small Apertures
Developing an effective, fast-curing, environmentally sound conformal coating
Testing Digital Designs - The Boundary-scan Balance
Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures
Modern 2D / 3D X-Ray Inspection - Emphasis on BGA, QFN, 3D Packages, and Counterfeit Components
Evaluating The Accuracy Of a Nondestructive Thermocouple Attach Method For Area-Array Package Profiling
Solder Materials Science Gets Small as Miniaturization Challenges Old Rules
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Training online, at your facility, or at one of our worldwide training centers"
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"IPC training online, at your facility, or at one of our worldwide training centers including our brand-new training center in the Twin-Cities area of Minnesota. Blackfox Training."
High Throughput Reflow Oven
High Resolution Fast Speed Industrial Cameras.
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Express Newsletter
[3/19] Robust Reliability Testing For Drop-on-Demand Jet Printing
[3/12] Filling of Microvias and Through Holes by Electrolytic Copper Plating ��� Current Status and Future Outlook
[2/27] Dispensing EMI Shielding Materials: An Alternative to Sputtering
[2/20] Coat-and-Print Patterning of Silver Nanowires for Flexible and Transparent Electronics
[2/13] Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
[2/06] Accurately Capturing System-Level Failure of Solder Joints
[1/30] Key Advances in Void Reduction in the Reflow Process Using Multi-Stage Controlled Vacuum
[1/23] Analysis of Inspection of DPA Test Requirements Applied To Flip Chip Technologies
[1/16] Ultra-Thin Chips For High-Performance Flexible Electronics
[1/09] Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
[1/02] Temperature Cycling and Fatigue in Electronics
[12/27] A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
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