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SMT Express, Volume 5, Issue No. 11 - from SMTnet.com

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology

A Novel Local Search Integer-Programming-Based Heuristic for PCB Assembly on Collect-and-Place Machines

A Novel Local Search Integer-Programming-Based Heuristic for PCB Assembly on Collect-and-Place Machines A Novel Local Search Integer-Programming-Based Heuristic for PCB Assembly on Collect-and-Place Machines by: Anupam Seth, Diego Klabjan, Placid

SMTnet Express September 5 - 2013, Subscribers: 26246

SMTnet Express September 5, 2013, Subscribers: 26246, Members: Companies: 13466, Users: 35123 Conformal Surface Plasmons Propagating on Ultrathin and Flexible Films by Xiaopeng Shen,Tie Jun Cui,Diego Martin-Cano, Francisco J. Garcia

PCB Dynamic Coplanarity At Elevated Temperatures

Novel Probing Concepts for Mass-Production Tests: Design and Challenges

Thermal Characteristics of PCB Laminates used in High Frequency Applications

New Developments in PCB Laminates

SMTnet Express July 18 - 2013, Subscribers: 26169