1020 shelf life bare board results

Strength of Lead-free BGA Spheres in High Speed Loading

SMT Express, Issue No. 5 - from SMTnet.com

Voiding Control for QFN Assembly

SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

BGA Package Component Reliability After Long-Term Storage

BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension

SMT Express, Issue No. 3 - from SMTnet.com

specified board, micro-stencil, part, and solder paste to

SMT Express, Issue No. 2 - from SMTnet.com

SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Return to Previous Page PRINTED CIRCUIT BOARD FABRICATION BASICS AN OUTLINE Earl Moon Proof Of Design (POD) PURPOSE AND SCOPE

SMTnet Express - March 3, 2022

Dross and the Selective Soldering Process

Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments