55 shocks results

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com

SMTnet Express - January 2, 2014

SMTnet Express, January 2, 2014, Subscribers: 26448, Members: Companies: 13543, Users: 35577 Thermal Shock and Drop Test Performance of Lead-free Assemblies with No-Underfill and Corner-Underfill by Bankeem Chheda, S. Manian Ramkumar, Ph

SMTnet Express - June 26, 2014

SMTnet Express, June 26, 2014, Subscribers: 22868, Members: Companies: 13912, Users: 36398 Enhancing Mechanical Shock Performance Using Edgebond Technology Steven Perng, Tae-Kyu Lee, and Cherif Guirguis; Cisco Systems , Edward S. Ibe; Zymet

SMT Express, Volume 2, Issue No. 11 - from SMTnet.com

SMT Express, Volume 4, Issue No. 9 - from SMTnet.com

SMTnet Express - April 2, 2015

SMTnet Express - November 30, 2017

Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs

Drop Shock Reliability of Lead-Free Alloys – Effect of Micro-Additives

Drop Shock Reliability of Lead-Free Alloys – Effect of Micro-Additives News Forums Equipment Mart Company Directory Event's Calendar Career Center Advertising Drop Shock Reliability of Lead-Free Alloys – Effect of Micro-Additives The drop shock

Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies