Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission SMTnet Express January 3, 2013, Subscribers: 26072, Members: Companies: 9076, Users: 34113 Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
IPC Printed Circuits Expo APEX Register | Conference Brochure | Video Preview IPC Printed Circuits Expo, APEX and the Designers Summit Las Vegas, March 11 2008 (APEX) IPC expects more than 13,000 individuals
