993 smd adhesive wave soldering results

Minimizing Voiding In QFN Packages Using Solder Preforms

Minimizing Voiding In QFN Packages Using Solder Preforms SMTnet Express July 27, 2012, Subscribers: 25333, Members: Companies: 8933, Users: 33366 Minimizing Voiding In QFN Packages Using Solder Preforms First published in the 2012 IPC APEX EXPO

SMTnet Express - January 5, 2014

The Proximity of Microvias to PTHs And Its Impact On The Reliability

Screening for Counterfeit Electronic Components

Optimizing Thermal & Mechanical Performance in PCBs

SMTnet Express - October 16, 2014

SMTnet Express, October 16, 2014, Subscribers: 23409, Members: Companies: 14079, Users: 36964 Oxide Thickness and Solderability Methodology to Determine Long Term Storage of BGAs and QFPs. Rama Hegde, senior member of technical staff; Freescale

Novel Probing Concepts for Mass-Production Tests: Design and Challenges

SMTnet Express - April 17, 2014

SMTnet Express - April 14, 2016

New Ideas... For New Horizons at IPC APEX EXPO 2014