Reduced Oxide Soldering Activation (ROSA) News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Reduced Oxide Soldering Activation (ROSA) American Competitiveness Institute
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
's surface resulting in better adhesion of the c
SMTnet Express, August 6, 2015, Subscribers: 23,145, Members: Companies: 14,536, Users: 38,702 Enclosed Media Printing as an Alternative to Metal Blades Michael L. Martel; Speedline Technologies, Inc. Fine pitch/fine feature solder paste printing
