SMTnet Express, March 3, 2016, Subscribers: 24,124, Companies: 15,000, Users: 40,059 Nanocopper Based Paste for Solid Copper Via Fill David Ciufo, Sujatha Ramanujan, Janet Heyen, Michael Carmody; Intrinsiq Materials , Sunny Patel; Candor
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
Pad Cratering - The Invisible Threat to the Electronics Industry SMTnet Express September 6, 2012, Subscribers: 25455, Members: Companies: 8972, Users: 33613 Pad Cratering - The Invisible Threat to the Electronics Industry First published
smeared solder paste pattern. A typical pad size for
