SMTnet Express, January 8, 2015, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Effect of Pb Mixing Levels on Solder Joint Reliability and Failure Mode of Backward Compatible, High Density Ball Grid Array Assemblies Richard
SMTnet Express, Octomer 29, 2020, Subscribers: 28,069, Companies: 11,166, Users: 26,207 Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process Credits: Sanmina-SCI For companies
SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb
SMTnet Express, March 06, 2014, Subscribers: 22524, Members: Companies: 13810, Users: 35835 Investigation and Development of Tin-Lead and Lead-Free Solder Pastes to Reduce the Head-In-Pillow Component Soldering Defect. Jasbir Bath, Roberto Garcia
SMTnet Express, January 30, 2014, Subscribers: 26500, Members: Companies: 13561, Users: 35693 Going Lead Free With Vapor Phase Soldering - Lead Free Is Still a Challenge For Major Industries. by Andreas Thumm; IBL-Löttechnik GmbH As of today
