for multilayer chip inductors. A basic requirement is to achi
Aiming for High First-pass Yields in a Lead-free Environment Aiming for High First-pass Yields in a Lead-free Environment While the electronics manufacturing industry has been occupied with the challenge of RoHS compliance and with it, Pb
Conductive Adhesives: The Way Forward Conductive Adhesives: The Way Forward Conductive Adhesives represent an intrinsically clean, simple and logical solution for a myriad of electrical interconnect challenges. Adhesives not only provide a "lead
Tin Whiskering on PCBA Capacitors in Storage (Inside ESD Bag, Inside a Sealed Cardboard Box) Tin Whiskering on PCBA Capacitors in Storage (Inside ESD Bag, Inside a Sealed Cardboard Box) The tin whisker failures investigated in this paper were
Dispelling 10 Myths About Nitrogen Reflow Dispelling 10 Myths About Nitrogen Reflow In my twenty years in the electronics manufacturing industry, I have heard a lot of claims made about the use of nitrogen in inerted soldering processes: many
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
Kurwa; Flextronics International A molded interco
