SMTnet Express, April 30, 2020, Subscribers: 36,108, Companies: 10,995, Users: 25,780 Selective Solder Fine Pitch Components On High Thermal Mass Assembly Credits: ITW EAE The number of through-hole components on PCBs has declined significantly
Process optimization -Lead free wave soldering of simple to highly complex boards Process optimization Lead free wave soldering of simple to highly complex boards This research takes an in-depth look at the challenges encountered
Fundamentals of Solder Paste Technology Fundamentals of Solder Paste Technology Solder pastes are key materials in surface mount technology (SMT) for assembly of printed circuit boards (PCBs). Introduction of lead-free has placed new demands
Inclusion Voiding in Gull Wing Solder Joints SMTnet Express August 30, 2012, Subscribers: 25432, Members: Companies: 8960, Users: 33565 Inclusion Voiding in Gull Wing Solder Joints First published in the 2012 IPC APEX EXPO technical conference
SMTnet Express, Octomer 29, 2020, Subscribers: 28,069, Companies: 11,166, Users: 26,207 Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process Credits: Sanmina-SCI For companies
SMTnet Express, May 13, 2021, Subscribers: 27,139, Companies: 11,353, Users: 26,641 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding
