for evaluating the solderability of surface finishes on
SMTnet Express, April 25, 2019, Subscribers: 31,876, Companies: 10,750, Users: 26,040 The EMS Gateway Model - Local to Global, Seamlessly Credits: ZOLLNER ELECTRONICS, INC. Choosing an outsourced manufacturing partner that is perfect for a new
The Future of Solder Joint Encapsulant Online Version SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced
SMTnet Express, April 3, 2014, Subscribers: 22618, Members: Companies: 13853, Users: 35982 A System Level Electrostatic Discharge Protection Modeling Methodology for Time Domain Analysis. Nicolas Monnereau, Fabrice Caignet, David Trémouilles
SMTnet Express, May 22, 2014, Subscribers: 22782, Members: Companies: 13894, Users: 36234 Pb-free solders: Comparison of different geometrical models in calculating of enthalpy of mixing of In-Sn-Zn ternary system. A. Boulouiz, M. El Moudane, M
SMTnet Express, January 14, 2016, Subscribers: 23,987, Members: Companies: 14,894, Users: 39,724 The Future of Solder Joint Encapsulant Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. Solder joint encapsulant adhesives have been
SMTnet Express, December 27, 2019, Subscribers: 33,251, Companies: 10,949, Users: 25,451 A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism Credits: Beihang University PTH plays a critical role in PCB reliability. Thermal
Method of Modeling Differential Vias Method of Modeling Differential Vias Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high
SMTnet Express, September 16, 2021, Subscribers: 26,691, Companies: 11,438, Users: 26,841 Mathematical Model For Dynamic Force Analysis Of Printed Circuit Boards Mathematical model for dynamic force analysis of printed circuit