Process optimization -Lead free wave soldering of simple to highly complex boards Process optimization Lead free wave soldering of simple to highly complex boards This research takes an in-depth look at the challenges encountered
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
SMTnet Express, October 2, 2014, Subscribers: 23352, Members: Companies: 14077, Users: 36923 Assembly Process Feasibility of Low/No Silver Alloy Solder Paste Materials Jennifer Nguyen Ranilo Aranda, David Geiger, and Murad Kurwa; Flextronics
SMTnet Express, November 19, 2014, Subscribers: 23530, Members: Companies: 14112, Users: 37185 Effects of Packaging Materials on the Lifetime of LED Modules Under High Temperature Test Lei Nie, Wenjing Xiang - Hubei University of Technology
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