987 solder balls removal results

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Volume 3, Issue No. 5 - from SMTnet.com

SMTnet Express - April 5, 2018

SMTnet Express, April 5, 2018, Subscribers: 30,982, Companies: 10,916, Users: 24,587 High Reliability and High Throughput Ball Bumping Process Solution – Solder Joint Encapsulant Adhesives Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced

SMT Express, Issue No. 3 - from SMTnet.com

for missing balls (BGA's - figure 23), or bent or missing l

SMT Express, Volume 3, Issue No. 6 - from SMTnet.com

Testing Digital Designs - The Boundary-scan Balance

SMT Express, Issue No. 3 - from SMTnet.com

Characteristics of Conformal Coating

SMT Express, Volume 5, Issue No. 12 - from SMTnet.com

Five Myths of Reliability