995 solder bridge on micro bga results

Selective Soldering Process

Selective Soldering Process Selective Soldering Process Although many through-hole components are being replaced by their surface mount (SMT) counterparts, printed circuit boards (PCBs) are still being designed with both types of components

SMT Express, Volume 3, Issue No. 5 - from SMTnet.com

Bridging at Reflow, What is the Cause and Can it be Eliminated?

Bridging at Reflow, What is the Cause and Can it be Eliminated? SMTnet Express April 12, 2012, Subscribers: 25060, Members: Companies: 8851, Users: 32937 Bridging at Reflow, What is the Cause and Can it be Eliminated? by: Robert Dervaes, V

Pin in Paste Stencil Design for Notebook Mainboard

De-fluxing Eases "Sticky Situations"

SMT Express, Issue No. 3 - from SMTnet.com

SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) SOLDER PASTE APPLICATION (WHEN AND AS SPECIFIED) Select

Solder Paste Inspection Technologies: 2D-3D Correlation

Solder Paste Inspection Technologies: 2D-3D Correlation Solder Paste Inspection Technologies: 2D-3D Correlation It is understood that the solder paste printing process presents far more opportunities for defects than any of the other individual

Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Micro-Sectioning of PCBs for Failure Analysis

Micro-Sectioning of PCBs for Failure Analysis Thank you for being a part of SMTnet. From all of us at SMTnet, we wish you a happy and prosperous New Year! Micro-Sectioning of PCBs for Failure Analysis Micro-sectioning (sometimes referred

The Environmental Impact of Pick-and-place Machines