SMTnet Express, December 27, 2013, Subscribers: 26441, Members: Companies: 13537, Users: 35564 Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly by Mario Scalzo; Indium Corporation While the electronics manufacturing
SMTnet Express, July 2, 2020, Subscribers: 28,589, Companies: 11,034, Users: 25,930 A PROCEDURE TO DETERMINE HEAD-IN-PILLOW DEFECT AND ANALYSIS OF CONTRIBUTING FACTORS Credits: Cookson Electronics Head-in-Pillow (HIP) defects are a growing concern
Testing to Eliminate Reliability Defects from Electronic Packages News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Testing to Eliminate Reliability Defects
SMT Express, Volume 2, Issue No. 6 - from SMTnet.com Volume 2, Issue No. 6 Wednesday, June 14, 2000 Featured Article Return to Front Page Process Control for Solder Flux Stacy KaliszMark OwenMVTechnology Ltd. ABSTRACT Flux used in ball grid
the defect rate of the measured machine. For exampl
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 1 Page 3 >> Knowing the capability coefficients, it is possible to estimate the defect rate of the measured machine. For example, Cpk = 1
Defect Coverage for Non-Intrusive Board Tests Defect Coverage for Non-Intrusive Board Tests Non-intrusive board test (NBT) is an emerging test methodology that integrates several complementary embedded-instrumentation-based test technologies
Solder Materials Science Gets Small as Miniaturization Challenges Old Rules Solder Materials Science Gets Small as Miniaturization Challenges Old Rules Though designing much smaller packages presents its own unique set of hurdles (a topic
SMTnet Express, March 22, 2018, Subscribers: 30,947, Companies: 10,909, Users: 24,534 Using Lean Six Sigma to Optimize Critical Inputs on Solder Paste Printing Tom Watson; Kimball Electronics, Inc. Solder paste printing is the first step
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