-free", "no clean" alternative to solder, these high
SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Featured Article Return to Front Page HASL WHAT A HASSLE, or HASL'd AGAINby Earl Moon INTRODUCTION This article updates one I wrote for Printed
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
Featured Article Return to Front Page REFLOW SOLDERING
SMTnet Express, July 14, 2022, Subscribers: 25,319, Companies: 11,585, Users: 27,344 █ Electronics Manufacturing Technical Articles Reliability Testing For Microvias In Printed Wire Boards Traditional single level microvia structures