reliability of solder joints has become a major i
design of robust solder reflow profiles. This paper go
of air pressure to dispense solder paste from syringe
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SMTnet Express, September 11, 2014, Subscribers: 23214, Members: Companies: 14043, Users: 36809 Reliability of Reworked QFNs. Bob Wettermann; Business Electronics Soldering Technologies (BEST) Inc. Recently, the impact of leadless device
SMTnet Express, October 3, 2018, Subscribers: 31,373, Companies: 11,056, Users: 25,258 Fill the Void II: An Investigation into Methods of Reducing Voiding Tony Lentz - FCT Assembly , Patty Chonis, JB Byers - A-Tek Systems Voids in solder joints
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
