Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
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Hwaseong-si, South Korea
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