Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
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SMT Express, Volume 5, Issue No. 8 - from SMTnet.com Equipment Impacts of Lead Free Wave Soldering The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today�s Wave Solder systems
Matrix Maintenance in PXI with BIRST Werner Engelmaier: "Mr Reliability" passes. Matrix Maintenance in PXI with BIRST Switching systems, and in particular matrices are a key part of many tests systems. They allow a single core set of test
