986 solder not sticking to pads results

SMTnet Express - August 31, 2017

Productronica 2007 Special Show Report

SMT Express, Volume 3, Issue No. 2 - from SMTnet.com

SMT Express, Issue No. 1 - from SMTnet.com

Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

Hybrid Drying Technology for In-line Aqueous Cleaning of Lead-Free Assemblies

Hybrid Drying Technology for In-line Aqueous Cleaning of Lead-Free Assemblies

SMTnet Express - March 3, 2022

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