1143 solder on gold a defect results

SMT Express, Volume 4, Issue No. 2 - from SMTnet.com

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SMTnet Express - August 7, 2014

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SMT Express, Volume 2, Issue No. 9 - from SMTnet.com

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Defect Free QFN Assembly

Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder

SMT Express, Volume 4, Issue No. 9 - from SMTnet.com

SMT Express, Volume 4, Issue No. 9 - from SMTnet.com Volume 4, Issue No. 9 Thursday, September 19, 2002 SMTnet Announcement SMTnet Assembles Professional Focus Group SMTnet invites you to join a focus group of your peers to evaluate proposed

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Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

packages (CSPs) on a standard JEDEC drop reliability test